X-Ray Inspection to detect Critical Defects during BGA Assembly
In today’s high-performance electronics, especially within the defence and aerospace sectors, what you can’t see can absolutely hurt you. As we rely more on complex components like Ball Grid Array (BGA) packages and dense, multi-layer Printed Circuit Boards (PCBs), another class of defects has emerged: those hidden deep within the assembly, completely invisible to the […]
Read MoreWhy X-Ray Counters Are Now Essential for Modern SMT Lines
In the world of high-precision electronics manufacturing, the greatest enemy is uncertainty. Every process, from paste printing to final inspection, is meticulously controlled to eliminate variables. Yet, for years, one of the most critical stages—component inventory management—has been left to a system plagued by guesswork, inefficiency, and risk: manual counting. At Zenaca Consulting, we have […]
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