Tag Archives: PCB Defects

X-Ray Inspection to detect Critical Defects during BGA Assembly

In today’s high-performance electronics, especially within the defence and aerospace sectors, what you can’t see can absolutely hurt you. As we rely more on complex components like Ball Grid Array (BGA) packages and dense, multi-layer Printed Circuit Boards (PCBs), another class of defects has emerged: those hidden deep within the assembly, completely invisible to the […]